The automotive semiconductor advanced packaging market is estimated to expand 12% from 2023 to 2030. Advances in packaging technology allow ICs to be connected to boards. It includes fan-out-wafer-level packaging, system-in-package, and 2.5D packaging, among others.The contemporary integrated circuit (IC) packaging sector in the automotive market has seen substantial growth as a direct result of the growing demand for higher levels of automation and performance in automobiles. Because of these shifts in the market for automobiles, vehicles will soon be able to boast increased dependability and intelligence.

The semiconductor packaging industry is shifting its focus to prioritise the development of advanced packages in order to meet the increasingly complex demands of the next generation of the automotive market. This is being done in order to meet the growing complexity of the demands of the automotive market. Integrated circuits used in automobiles typically come in wirebond packages. The packaging industry is shifting toward high performance flip chip and advanced fan-out packages for automotive infotainment, GPS, and radar applications as a result of the increasing complexity and higher performance requirements of automotive applications. These changes are being brought about by the fact that automotive applications are becoming increasingly demanding of their hardware.

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The market for advanced packaging israpidly expanding, due to the rising demand for Internet of Things (IoT) and automation in automotive industry. Advanced packaging suppliers are working to develop processes and methods that will reduce the overall cost of advanced packaging and provide the highest possible level of operational efficiency. Because of the high costs involved in its operation, advanced packaging is typically only utilised for high-end applications. Because different integrated circuits (ICs) have distinct packaging requirements, there are growing potential for advanced packaging as opposed to the standard packaging technique. In addition, conventional packaging solutions are anticipated to have lower capabilities than those offered by advanced packaging, which is anticipated to offer profitable opportunities for emerging market trends in advanced packaging in the years to come.

In order to design chips for the future, the semiconductor packaging industry is creating more advanced integrated circuit packages. The IC industry has relied on inventive architectures for novel device designs in addition to chip scaling. Multichip packages exist in every phone, data centre, consumer electronic product, and network. This is a key driver of improved packaging because it improves system efficiency. Advanced packaging makes it feasible to include wide variety of processing components and memories via high-speed interconnects, encouraging the adoption of AI, ML, and deep learning (DL). Increased operation capabilities and precise processing are needed in auto.

The Fan-out wafer-level packaging (FOWLP) product type segment accounted for contributing a substantial market share in 2020 and is predicted to increase significantly throughout the forecast period. It is because of the substantial benefits that it provides, such as lower thermal resistance, substrate-less package, and higher performance. For example, on the 11th of January 2021, Veeco Instruments Inc. made the announcement that National Chiao Tung University (NCTU), which is located in Hsinchu, Taiwan, has chosen Veeco to be an important partner in its initiative to boost the production of semiconductors in Taiwan. NCTU is based in Hsinchu.

The U.S. accounts for more than 9.5% of the global market in 2020, while China is expected to grow 9.3% between 2023 and 2030. China, the second largest economy, will have the greatest market size and highest CAGR throughout the forecast period. Japan and Canada are two more key markets expected to grow by 5% and 6.2%, respectively, during 2023-2030. Germany's CAGR is expected to be 5.5%.

Top market players in advanced packaging use a range of growth strategies to enhance their market share. Product launch, development, cooperation, partnership, and agreements are among the strategies. The research reveals the strategies of 1st, 2nd, and 3rd tier companies. Key businesses in this area include Amkor Technology, Intel Corporation, Qualcomm Technologies Inc., Taiwan Semiconductor Manufacturing Company, IBM, Microchip Technology, Renesas Electronics Corporation, Texas Instruments, and Analog Devices.

Key Market Trends

• The automotive semiconductor advanced packaging market is estimated to expand 12% from 2023 to 2030.
• The Fan-out wafer-level packaging (FOWLP) product type segment accounted for contributing a substantial market share in 2020 and is predicted to increase significantly throughout the forecast period.
• The U.S. accounts for more than 9.5% of the global market in 2020,
• China is expected to grow 9.3% between 2023 and 2030.
• Japan and Canada are two more key markets expected to grow by 5% and 6.2%, respectively, during 2023-2030.
• Germany's CAGR is expected to be 5.5%.
• Key players in this market include Amkor Technology, Intel Corporation, Qualcomm Technologies Inc., Taiwan Semiconductor Manufacturing Company, IBM, Microchip Technology, Renesas Electronics Corporation, Texas Instruments, Analog Devices and others.

Market Segmentation

*Complete segmentation list is on report page