The integrated passive device (IPD) market is a pivotal component of the electronics industry, playing a crucial role in the miniaturization and integration of electronic circuits. The integrated passive device market is expected to grow at a CAGR of 8.3% during the forecast period of 2024 to 2032, driven by the rising demand for baluns in wireless communication, the growing significance of ceramic substrates, and the increasing demand for diplexers in telecommunication. Challenges in silicon substrate integration underscore the need for ongoing research and development. The segmentation by passive devices and substrate provides a nuanced understanding of market dynamics, emphasizing the shift towards diplexers and the prominence of ceramic substrates. The geographic segmentation underscores global trends and the pivotal role of regions like Asia-Pacific in shaping the future of integrated passive devices.
Rising Demand for Baluns in Wireless Communication
The integrated passive device market experiences a substantial boost from the rising demand for baluns in wireless communication. Evidential data indicates that key players, including Murata Manufacturing Co., Ltd. and ON Semiconductor Corporation, have witnessed increased adoption of baluns in RF (Radio Frequency) applications. The integration of baluns in wireless communication devices, such as smartphones and IoT devices, contributes to enhanced signal integrity and improved performance. The market, driven by this driver, witnessed significant growth in 2023, with baluns being a major revenue contributor.
Growing Significance of Ceramic Substrates
The growing significance of ceramic substrates emerges as another driver for the integrated passive device market. Evidence-based insights reveal that companies like STATS ChipPAC Pte. Ltd. and Johanson Technology, Inc. are actively focusing on the development of IPDs using ceramic substrates. In 2023, ceramic substrates are expected to contribute significantly to both revenue and the highest CAGR during the forecast period from 2024 to 2032. This driver underscores the importance of ceramic substrates in achieving high-performance, miniaturized electronic components, catering to the demands of diverse applications in consumer electronics and automotive sectors.
Increasing Demand for Diplexers in Telecommunication
The increasing demand for diplexers in telecommunication acts as a driving force for the integrated passive device market. Evidence suggests that companies like AVX Corporation and STMicroelectronics are actively involved in meeting the rising demand for diplexers, particularly in 5G networks. In 2023, diplexers are projected to contribute significantly to both revenue and the highest expected CAGR during the forecast period. This driver highlights the crucial role of IPDs in supporting the expansion and optimization of telecommunication networks, emphasizing their contribution to the seamless integration of multiple frequency bands.
Challenges in Silicon Substrate Integration
Despite the positive momentum, challenges in silicon substrate integration pose a notable restraint to the integrated passive device market. Evidential data suggests occasional hurdles in achieving optimal performance and cost-effectiveness when integrating IPDs on silicon substrates. Companies, including Infineon Technologies AG and ON Semiconductor Corporation, actively address these challenges, emphasizing the need for continuous research and development to overcome silicon-specific limitations. This restraint underscores the importance of substrate selection and ongoing efforts to enhance the compatibility of IPDs with silicon, a widely used but challenging substrate.
Market Analysis by Passive Devices: Filters Dominate the Market
Market segmentation by passive devices reveals dynamic trends in baluns, filters, couplers, diplexers, resonators, and other components. In 2023, filters dominated the market, contributing both the highest revenue and a significant share. However, diplexers are expected to exhibit the highest CAGR during the forecast period from 2023 to 2031. This segmentation underscores the evolving landscape of IPDs, with a notable shift towards the increased demand for diplexers, particularly in telecommunication applications.
Market Analysis by Substrate: Ceramic Substrates Dominate the Market
The market segmentation by substrate highlights the dynamics of silicon, glass wafers, GaAs (Gallium Arsenide), and ceramic substrates. In 2023, ceramic substrates are projected to contribute substantially to both revenue and the highest CAGR during the forecast period from 2024 to 2032. This segmentation provides insights into the critical role of substrates in determining the performance and applications of IPDs, with ceramic substrates gaining prominence for their superior characteristics.
APAC Remains the Global Leader
The geographic segmentation of the integrated passive device market unveils global trends and regional variances. In 2023, Asia-Pacific led in terms of both revenue and market share, with companies like Murata Manufacturing Co., Ltd. and STATS ChipPAC Pte. Ltd. making substantial contributions. However, North America is expected to exhibit the highest CAGR during the forecast period, driven by factors such as increased R&D activities and collaborations with leading technology companies. This shift highlights the global nature of the market and the need for region-specific strategies to cater to diverse research landscapes.
Market Competition to Intensify during the Forecast Period
The competitive landscape of the integrated passive device market is characterized by strategic collaborations and a holistic market outlook. In 2023, key players, including Murata Manufacturing Co., Ltd., ON Semiconductor Corporation, AVX Corporation, CTS Corporation, Global Communication Semiconductors, LLC, Infineion Technologies AG, Johanson Technology, Inc, MACOM, NXP Semiconductors, Qurvo, Inc., STMicroelectronics and Texas Instruments Incorporated., dominated the market, reflecting their comprehensive capabilities and significant contributions to IPD technology. Strategies encompass collaborative ventures with semiconductor manufacturers, expansion of IPD portfolios, and investments in cutting-edge technologies. Looking ahead to the period from 2024 to 2032, these key players are expected to continue their strategic initiatives, adapting to emerging market dynamics and contributing to the advancement of integrated passive devices on a global scale.
Historical & Forecast Period
This study report represents analysis of each segment from 2022 to 2032 considering 2023 as the base year. Compounded Annual Growth Rate (CAGR) for each of the respective segments estimated for the forecast period of 2024 to 2032.
The current report comprises of quantitative market estimations for each micro market for every geographical region and qualitative market analysis such as micro and macro environment analysis, market trends, competitive intelligence, segment analysis, porters five force model, top winning strategies, top investment markets, emerging trends and technological analysis, case studies, strategic conclusions and recommendations and other key market insights.
Research Methodology
The complete research study was conducted in three phases, namely: secondary research, primary research, and expert panel review. key data point that enables the estimation of Integrated Passive Device market are as follows:
Market forecast was performed through proprietary software that analyzes various qualitative and quantitative factors. Growth rate and CAGR were estimated through intensive secondary and primary research. Data triangulation across various data points provides accuracy across various analyzed market segments in the report. Application of both top down and bottom-up approach for validation of market estimation assures logical, methodical and mathematical consistency of the quantitative data.
ATTRIBUTE | DETAILS |
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Research Period | 2022-2032 |
Base Year | 2023 |
Forecast Period | 2024-2032 |
Historical Year | 2022 |
Unit | USD Million |
Segmentation | |
Passive Devices
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Packaging
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Application
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End-Use
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Region Segment (2022-2032; US$ Million)
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Key questions answered in this report