Wide Application to Give Boost to the Test and Burn-in Sockets Market
The test and burn-in sockets market worldwide is expected to grow with a CAGR of 5.6% during the forecast period from 2023 to 2030. The test and burn-in sockets market is driven by the connector market. The test and burn-in sockets denote a small but challenging segment of the connector market. The designs of the sockets are robust, leading edge and are produced in small quantities. The sockets are widely used in smartphones and driving assistance systems. As a result, we expect the market to grow with a rapid pace throughout the forecast period.
CMOS Image Sensor Set to Dominate the Market
The test and burn-in sockets market by application type is led by CPU & SPU segment. Owing to wider adoption of SPU and CPU in high-speed vector processing, the sale of test and burn-in socket has been significant. Further, the CMOS image sensor market is expected to grow at the fastest pace at a CAGR of 8.7% during the forecast period. Due to emergence of self-driving cars and advanced driver assistance systems, the demand for CMOS image sensors from the automotive segment has been significant. Hence the CMOS image sensor segment shall continue to lead the test and burn-in sockets market throughout the forecast period.
Asia Pacific to be the Fastest Growing Region
North America led the test and burn-in sockets market. Growing demand for consumer electronics, and rapid increase in R & D activities are the major growth factors for North America. On the other hand, Asia Pacific will be the fastest-growing region. Asia-Pacific region has been growing ominously. Increased sale of communication equipment, computer, etc. prominently drive the demand for test and burn-in sockets market. Further, increase in number of smart phone users and high growth in automotive shall drive the test and burn-in sockets market. As a result of aforementioned factors, Asia Pacific will be the fastest growing segment throughout the forecast period.
Some of the prominent players operating in the test and burn-in sockets market Yamaichi Electronics, Cohu, Enplas, ISC, Smiths Interconect, LEENO, Sensata Technologies, Johnstech, Yokowo, WinWay Technologies, Loranger among others.
Historical & Forecast Period
This study report represents analysis of each segment from 2022 to 2032 considering 2023 as the base year. Compounded Annual Growth Rate (CAGR) for each of the respective segments estimated for the forecast period of 2024 to 2032.
The current report comprises of quantitative market estimations for each micro market for every geographical region and qualitative market analysis such as micro and macro environment analysis, market trends, competitive intelligence, segment analysis, porters five force model, top winning strategies, top investment markets, emerging trends and technological analysis, case studies, strategic conclusions and recommendations and other key market insights.
Research Methodology
The complete research study was conducted in three phases, namely: secondary research, primary research, and expert panel review. key data point that enables the estimation of Test And Burn-in Sockets market are as follows:
Market forecast was performed through proprietary software that analyzes various qualitative and quantitative factors. Growth rate and CAGR were estimated through intensive secondary and primary research. Data triangulation across various data points provides accuracy across various analyzed market segments in the report. Application of both top down and bottom-up approach for validation of market estimation assures logical, methodical and mathematical consistency of the quantitative data.
ATTRIBUTE | DETAILS |
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Research Period | 2022-2032 |
Base Year | 2023 |
Forecast Period | 2024-2032 |
Historical Year | 2022 |
Unit | USD Million |
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Region Segment (2022-2032; US$ Million)
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Key questions answered in this report